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dblp.uni-trier.de2014年12月22日 - Krit Athikulwongse, Mongkol Ekpanyapong, Sung Kyu Lim: Exploiting Die-to-Die Thermal Coupling in 3-D IC Placement. IEEE Trans. VLSI Syst.瀏覽：338 -
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dblp.uni-trier.de2014年12月22日 - The dblp computer science bibliography is the on-line reference for open bibliographic information on computer science journals and ...瀏覽：611
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日期：2025-11-10
View Krit Athikulwongse's professional profile. Publications: 11 | Citations: 46 Field Rating: 4. Fields of study: Hardware & Architecture, Engineering....
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日期：2025-11-12
Now showing items 1-1 of 1. 17-Aug-2012. Placement for fast and reliable through-silicon-via (TSV) based 3D-IC layouts · Athikulwongse, Krit. Dissertation....
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日期：2025-11-09
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