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![Flip chip - Wikipedia, the free encyclopedia]()
en.wikipedia.orgFlip chip, also known as controlled collapse chip connection or its acronym, C4, is a method for interconnecting semiconductor devices, such as IC chips and ...瀏覽：545 -
![林光隆的個人資料 - 國立成功大學 材料科學及工程學系]()
www.mse.ncku.edu.tw成功大學材料科學與工程學系是我國最早成立，以培育材料科技人才為宗旨的學術單位。不僅有悠遊的歷史、優良的系風，在學術單位及人才教育上均為國內材料學界的佼佼者。材料科學工程兼具科學所須的專業知識及研究精神，以及工程應用上不可或缺 ...瀏覽：1439
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日期：2024-04-22
錫膏的成份主要可以分為助焊劑(flux)與錫粉(powder)兩大部分。 錫粉（Powder） 錫粉也就是金屬合金，主要用途在體現焊接的強度，其主要成份包含有下列幾種： Sn(錫 ) Ag(銀) Cu(銅) Bi(鉍) 錫粉會因為不同錫膏的編號而有不同成分及比率組成，但既使式相同的 ......
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日期：2024-04-23
GENERAL Flip chip assembly by means of solder connection to the bond pads was the first commercial use of flip chip, dating to IBM’s introduction of flip chip in the 1960’s. Solder bump has the longest production history, the highest current and cumulativ...
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日期：2024-04-21
Solder (/ˈsoʊldə/,[1] /ˈsɒldə/[1] or in North America /ˈsɒdər/[2]) is a fusible metal alloy used to join together metal workpieces and having a melting point below that of the workpiece(s). Soft solder is typically thought of when solder or soldering is m...
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日期：2024-04-23
Solder Bumping Step by Step Tutorial #12 Deborah S. Patterson 2001 Wafer bumping is replacing wire bonding as the interconnection of choice for a growing number of components. The broad term “wafer bumping” will be defined in this article as the process b...
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日期：2024-04-20
The target for the solder bump alloy in this case was a tin copper alloy with 0.7% copper. The source of the copper ions for the alloy is the electroless seed layer used to metallise the solder mask surface. Theoretical tests were made to determine the op...
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日期：2024-04-17
The thermal copper pillar bump, also known as the "thermal bump", is a thermoelectric device made from thin-film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and optoelectron...
ENIG vs. ENEP(() pG) Under Bump Metallization for Lead-free WL-CSP Solder Bumps – a Comparison of In
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日期：2024-04-23
ENIG vs. ENEP(() pG) Under Bump Metallization for Lead-free WL-CSP Solder Bumps – a Comparison of Intermetallic Properties Using High Speed Pull Test IMAPS International Conference on Device PackagingIMAPS International Conference on Device Packaging...
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日期：2024-04-21
Name: tripen Time: Friday, July 29, 2011 What type of paste you recomend for 250micron bump for rework process where due to two packages preheat cycle and reflow cycle is longer then front end process. - Thanks. I would also like to understand type-6 dipp...
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