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AMD and Hynix announce joint development of HBM memory stacks | Solid State Technology
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日期：2024-05-19
3DIC memory, and therefore all of 2.5/3D technology, took one step closer to full commercialization last week with the HBM joint development announcement from AMD and Hynix at the RTI 3D ASIP meeting in Burlingame CA. Bryan Black, Sr Fellow and 3D program...看更多
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