chip on board encapsulation的相關文章
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Advanced IC Assembly | Chip on Board/Chip on Flex | Flip Chip Bonding | Quik-Pak
瀏覽：793
日期：2026-04-20
Quik-Pak has the capability to attach and bond die on printed circuit boards and flex circuits measuring up to 5" by 8" and even larger, using our range of wire bond equipment. Passive components can be mounted and die protected with encapsulation, frame ...看更多
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