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Chip-on-Board > IC Packaging > Services & Products : Tektronix Component Solutions
瀏覽：1490
日期：2025-04-25
Tektronix Component Solutions offers custom chip on board assembly services utilizing either flip chip or wire bond interconnect methodologies. ... A chip-on-board (COB) IC packaging solution shortens the signal path down to the board-level, improving sig...看更多
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