Millimeter-Wave Transceiver Module Integration in 3D Silicon Interposer Technology

Millimeter-Wave Transceiver Module Integration in 3D Silicon Interposer Technology

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日期:2026-04-22
State-of-the-Art – Previous work | 6 60-GHz Transceiver module on ceramic (CEA-LETI/STM) HTCC module (Kyocera), size 12.5x8.5x0.5 mm3, CMOS transceiver and CMOS PA (CMOS 65 nm, STM) Folded dipole antenna on glass (IPD techno., STM), LGA ......看更多