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Next Generation Nickel-Based Bond Pads Enable Copper Wire Bonding
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日期：2026-04-25
BOND PAD SOLUTIONS – NEXT GENERATION NI-BASED BOND PAD The ideal next generation bond pad would address the needs of all of the emerging technolo-gies, including copper wire bonding, ultra fine pitch gold wire bonding, ultra low-k dielectrics with ......看更多
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