Small Precision Tools - QFN Package Copper & Gold Wire Bonding Capillary

Small Precision Tools - QFN Package Copper & Gold Wire Bonding Capillary

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日期:2026-04-26
The QFN package tie bar width and thickness design greatly affect the wire bonding performance. Wider and thicker lead configuration are preferred as this will have lower reaction towards leads bouncing during the wire bonding process. Lead bouncing is mo...看更多