Survey of Rework Methods/Equipmentand Contract Manufacturers for Various Packaging Technologies

Survey of Rework Methods/Equipmentand Contract Manufacturers for Various Packaging Technologies

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日期:2025-06-09
BGA rework utilizing metal stencils or removable stencils can fail for a number of reasons. ... http://documents.exfo.com/appnotes/anote097-ang.pdf) Don Moore and Gloria Studley, Semiconductor Equipment Corp., Moorpark, CA, http://www.semicorp.com ......看更多