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Triton Micro Technologies: Through-glass-via (TGV) interposer - 3D InCites
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日期：2025-10-23
Product Description Triton Micro Technologies’ ultra-thin through-glass-via (TGV) interposers create 3,000 or more I/O connections per device for high-density IC packaging. Triton uses micro-drilling and via-fill technologies to manufacture 2.5D and 3D TG...看更多
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