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Triton Micro Technologies: Through-glass-via (TGV) interposer
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日期：2025-10-21
ARIZ.-Triton Micro Technologies’ ultra-thin through-glass-via (TGV) interposers create 3,000 or more I/O connections per device for high-density IC packaging. Triton uses micro-drilling and via-fill technologies to manufacture 2.5D and 3D TGV interposers ...看更多
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