3d glass interposer的相關文章
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UltraHigh I/O Density Glass/Silicon Interposers for High Bandwidth Smart Mobile Applications
瀏覽:1412
日期:2026-04-27
TABLE II. Typical interconnect dimensions in 3D IC vs ultra-thin glass interposer 3D IC Ultra-thin Parameter with TSVs glass interposer Diameter 4-50µm 5-20µm TSV/TPV pitch 10-80µm 10-40µm Thickness 20-250µm 30-50µm RDL wiring Lines/Space .5-2µm 5-10µm...看更多






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