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Teams, industry judges descend on MU for DARPA-sponsored RevCon Challenge | Engineering // Mizzou //
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日期：2026-04-20
Bo Zhang helped lead MU’s presentation at the 2014 International Field-Reversible Thermal Connector Challenge, hosted Oct. 31 and Nov. 1 by the University of Missouri. The MU team, led by student presenters Zhang and Run Yan, took top honors in the design...看更多
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