Intel Mobile Communications Ships World's Smallest HSPA+ Solution for 3G Smart Phones

Intel Mobile Communications Ships World's Smallest HSPA+ Solution for 3G Smart Phones

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日期:2026-04-21
The XMM 6260 smart phone modem platform enables HSPA+ designs in less than 600mm 2 PCB (Printed Circuit Board) area, ... About Intel Mobile Communications Intel Mobile Communications develops and markets innovative semiconductor products and ......看更多