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![Anisotropic conductive film - Wikipedia, the free encyclopedia]()
en.wikipedia.orgAnisotropic conductive film (ACF), is a lead-free and environmentally friendly adhesive interconnect system that is commonly used in liquid crystal display manufacturing to make the electrical and mechanical connections from the driver electronics to the瀏覽：663 -
![AmTECH Microelectronics, Inc —]()
www.amtechmicro.comWelcome to AmTECH Your Manufacturing Solution! Call Today:(408) 227-8885 E-mail: info@amtechmicro.com Home About Us Advanced Packaging IC Assembly Chip-On-Board (COB) and Chip-On-Flex (COF) Encapsulation SMT Assembly SMT Assembly Lead ...瀏覽：1097
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![[技術專文]高密度COF接合技術- 《半導體科技．先進封裝與測試 ...](https://www.iarticlesnet.com/pub/img/site/s_45.jpeg)
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日期：2024-05-21
... 為TAB(Tape Automated Bonding)、COG(Chip on Glass)及COF(Chip on Flex) 三種主要的接合方式。...
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日期：2024-05-23
除了應用於LCD驅動，COF封裝還廣泛應用於噴墨列印頭、RFID和指紋傳感器等產品。如今，許多半導體 ......
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日期：2024-05-25
Swissbit's COF process is a special form of COB technology. It is a current trend for high quality solutions ......
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日期：2024-05-27
行動版 - Flexible Chip-on-Flex (COF) and embedded Chip-in-Flex (CIF) packages by applying wafer level ......
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日期：2024-05-23
demonstrated in a fine-pitch COF module with a two-layer flex substrate. Key words: Flip chip, ......
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日期：2024-05-20
SPECIMENS. COF packages specimen consists of a silicon chip and a flex substrate (1st flex substrate)....
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日期：2024-05-24
Recently, many researchers have introduced low temperature bonding technology using Anisotropic ......
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日期：2024-05-20
2013年12月9日 - ... 品牌廠也計畫採用以捲帶式薄膜覆晶(Chip-on-Flex, CoF)封裝技術製成的指紋辨識模組 ......
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