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日期:2024-04-21
講題. COF(chip on film)的製程及構裝運用. 講者. 鍾卓良. 服務. 單位. 義守大學. 材料系. 職稱. 副教授. 時間. 99年10月15日(星期五)14時30分至16時20分. 地點....
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日期:2024-04-18
Abstract. We developed a so-called "reel-to-reel method" COF technology using a long carrier tape for the LCD driver package. This method enables mass ......
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日期:2024-04-20
Samsung COF (Chip on Film) application areas, features, thermal performance, electrical performance and reliability. Find more package information here....
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日期:2024-04-19
陸蘇財、黃元璋 工研院電子所 LCD驅動IC的構裝需要高密度的接合技術來達成,目前依使用的構裝結構不同可區分為TAB(Tape Automated Bonding)、COG(Chip...
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日期:2024-04-18
There is a continuing trend to compactness and lighter weight in the development of electronic products, especially for flat panel displays with high-resolution requirement. As an advanced LCD driver semiconductor packaging technology, COF has many advant...
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日期:2024-04-23
Chip-on-Film Underfill (COF) Chip-on-Film Underfill is used for flexible substrates as insulating material used in mounting technologies involving direct electrical connections between IC chips and mounting boards. Chip-on-Film Underfill has the ability t...
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日期:2024-04-25
Samsung COF (Chip on Film) application areas, features, thermal performance, electrical performance and reliability. Find more package information here. ... As stated earlier, COFs cover a wide spectrum of applications and are the default technique to imp...
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日期:2024-04-25
Rank Abbr. Meaning COF Council On Foundations COF Capital One Financial (stock symbol) COF Cradle of Filth (band) COF College Opportunity Fund COF Coefficient of Friction COF Chip on Film COF Certificate of Fitness COF Colleges of the Fenway (since ......