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半導體科技.先進封裝與測試雜誌 - 可降低功率、改良特性與縮小尺寸的CoWoS製程 - Semicondutor Magazine

日期：2025-05-11

8pt 3>Jerry Tzou／台灣積體電路股份有限公司div> div> 10pt 3> fo ... EDA的夥伴們還有其他的EDA公司也參與此項計畫。例如Mentor提供多晶片的DRC、LVS以及參數萃取的實體驗證。...

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Taiwan Semiconductor Manufacturing Company Limited

日期：2025-05-12

TSMC CoWoS® (Chip-On-Wafer-On-Substrate) services use Through Silicon Via (TSV) technology to integrate multiple chips into a single device. This architecture provides higher density interconnects, decreases global interconnect length, and lightens associ...

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台灣積體電路製造股份有限公司

日期：2025-05-13

TSMC-Online | 網站地圖 | English 繁中簡中日本語 Dedicated Foundry Lighting Solar Investors Press Center Careers Corporate Social Responsibility About TSMC 專業技術晶圓製造服務卓越製造最新消息新聞集錦活動訊息影像資料...

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Xilinx and TSMC Reach Volume Production on all 28nm CoWoS™-based All Programmable 3D IC Families - O

日期：2025-05-15

Xilinx and TSMC Reach Volume Production on all 28nm CoWoS -based All Programmable 3D IC Families Proven CoWoS technology to scale with Xilinx's 20SoC and 16FinFET 3D ... SAN JOSE, Calif. and HSINCHU, Taiwan, Oct. 21, 2013 /PRNewswire/ -- Xilinx ......

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CoWoS(Chip on Wafer on Substrate) - 財經百科 - 財經知識庫 - MoneyDJ理財網

日期：2025-05-15

CoWoS(Chip on Wafer on Substrate)是一種整合生產技術，先將半導體晶片透過Chip on Wafer(CoW)的封裝製程連接至矽晶圓，再把此CoW晶片與基板連結，整合而成CoW-on-Substrate。 CoWoS是台積電致力發展2.5D/3D IC一條龍製程，公司要提供全套服務...

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© 2012 Altera Corporation - SEMICON West

日期：2025-05-16

Interposer Integration through Chip on Wafer on Substrate (CoWoS) Process John Y. Xie, Ph.D.; Deepa Ratakonda; Manish Deo; Kaushik Chanda; Yuan Li, Ph.D.; MJ Lee; Arif Rahman, Ph.D.; Nagesh Vodrahalli, Ph.D.; Hong Shi, Ph.D.; Zhe Li; Vincent Hool ......

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The 2014 European 3D TSV Summit: The Domino Effect | 3D Incites

日期：2025-05-16

The 2014 European 3D TSV Summit comprised 332 attendees from 21 countries, 24 presentations, 3 keynote speakers, and 2 panel discussions about 3D TSVS. ... I just boarded my flight home after attending the 2014 European 3D TSV Summit. Three days, 332 ......

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TSMC builds world’s first 32-core networking chip using 16nm FinFET process technology | KitGuru

日期：2025-05-14

This is actually great news as the Arm core on 16nm is giving a lot of experience to TSMC so that they can afford to do 20nm and 16nmFinFet at the same time leveraging on economies of scale to keep costs down for the chips. This will keep the pressure on ...

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