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Chip-on-Board (COB) Encapsulants - Henkel
瀏覽：909
日期：2025-10-14
Henkel’s line of LOCTITE Hysol® and LOCTITE Eccobond encapsulants are primarily used to ensure environmental protection and boost the mechanical strength of wire bonded devices. They are developed to provide protection to wire bonds, leads and aluminum....看更多
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