IEEE Xplore Abstract - Chip-on-board (COB) wafer level packaging ...

IEEE Xplore Abstract - Chip-on-board (COB) wafer level packaging ...

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日期:2025-11-16
Chip-on-board (COB) wafer level packaging of LEDs using silicon substrates and ... Glass; Light emitting diodes; Packaging; Phosphors; Silicon; Substrates ......看更多