chip on board assembly process的相關文章
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Printed Circuit Board Assembly | PCA Technology Limited
瀏覽：738
日期：2025-05-04
SMT Process (RoHs Compliant) Capabilities up to: 01005 Chip Size 12 mils Integrated Circuit (IC) Pitch Micro Ball Grid Array (BGA) – Pitch 16 mils, >1000 Ball count Chip Scale Package (CSP) – Bump Diameter 0.132mm, Pitch 16 mils Flip Chip (Controlled ......看更多
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