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QFN/DFN Package - Inspection of Solder Joints
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日期:2025-07-15
1 QFN/DFN Inspection of Solder Joints 1.0 Land Pad Design for QFN and DFN The industry standard IPC-SM-782 specifi cation is used as the reference for determining PCB land patterns. Since the QFN and DFN are new package styles, it is recommended that ......看更多