Solid State Technology | Insights for Electronics Manufacturing

Solid State Technology | Insights for Electronics Manufacturing

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日期:2025-06-24
Enhancing the Reliability of Flip Chip Assemblies with Underfill Encapsulants The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulants are carefully formu...看更多