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TB451: PCB Assembly Guidelines for Intersil Wafer Level Chip Scale Package Devices
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日期：2025-05-03
Technical Brief 451 4 TB451.4 December 8, 2014 Submit Document Feedback The PCB should be transferred to the pick-and-place machine within the time limit specified by the solder paste manufacturer after solder paste printing. Step 2: Pick-and-Place • Plac...看更多
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