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Chip Scale Package (CSP) Wire Bonding Capability Study
瀏覽：886
日期：2026-04-19
5 Loop Height (LHT) Min.: 75.0µm Max.: 90.0µm Ave.: 85.0µm SD: 5.3µm Die Edge to Wedge Distance (DEWD) Min.: 210µm Max.: 255µm Ave.: 230µm SD: 13.73µm Wire Pull Strength (WP) Min.: 6.1gms Max.: 7.5gms Ave.: 6.86gms SD: 0.47µm The experiment ......看更多
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