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Signal Integrity Design of TSV-Based 3D IC
瀏覽:1355
日期:2026-04-23
Signal Integrity Design of TSV-Based 3D IC June10 2010June10, 2010 Joungho Kim at KAIST joungho@ee.kaist.ac.kr http://tera.kaist.ac.kr TERA Terahertz Interconnection and ... Contents 1) Signal Integrity Issues in TSV-based 3D IC 2) Equalizer design 3) Ni ...看更多



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