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日期:2025-05-14
2010年10月10日 - 從這張流程圖可以大致看出COB會需要用到PCB(電路板)、Die(晶圓)、 Silver glue( 銀膠)、Al wire(鋁線)、Epoxy(環氧樹脂)等材料,有些材料或許可以 ......
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日期:2025-05-13
Electronic packaging. From Wikipedia, the free encyclopedia .... Glob-top is a
variant of conformal coating used in chip-on-board assembly (COB). It consists of
a ......
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日期:2025-05-07
In COB technology, a semiconductor chip is placed directly on a PCB, eliminating the packaging step thereby, COB comprises of bare dice on organic laminate substrates, such as FR4, along with other SMT devices, both packaged devices and discrete ......
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日期:2025-05-11
Henkel’s line of LOCTITE Hysol® and LOCTITE Eccobond encapsulants are primarily used to ensure environmental protection and boost the mechanical strength of wire bonded devices. They are developed to provide protection to wire bonds, leads and aluminum....
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日期:2025-05-12
While taking the second tour, I asked how the COB, or chip-on-board, manufacturing process happened. I expected it to be outsourced to a different facility but ......
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日期:2025-05-10
何謂COB (Chip On Board) ?介紹COB 的演進歷史COB (Chip On Board)在電子製造業已經是一項成熟的技術了,可是一般的組裝工廠對它的製程並不熟悉,也許是 ......
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日期:2025-05-07
A new breed of GU10 LED spotlights are coming to market using COB (chip on board) LEDs....
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日期:2025-05-14
目前較常被應用於LED照明產品的主流封裝技術是COB (Chip On Board),也就是直接將數顆LED晶粒排成陣列,經過上膠、螢光粉塗佈等程序黏貼在銅、鋁或陶瓷 ......