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瀏覽:1201
日期:2025-05-13
This archival Journal is a publication of the International Microelectronics And
Packaging Society (IMAPS) and is dedicated to publishing peer-reviewed papers
......
瀏覽:785
日期:2025-05-18
Journal of Microelectronics ... Knut E. Aasmundtveit, Vestfold University College.
1. LT-TLPS Die Attach for High Temperature Electronic Packaging Hannes ......
瀏覽:1361
日期:2025-05-18
Journal of Microelectronics and Electronic Packaging (ISSN # 1551-4897). Editor
-in-Chief: Jianbiao "John" Pan, Ph.D. California Polytechnic State University...
瀏覽:1392
日期:2025-05-12
IMAPS mission: advance and expand the use of microelectronics and its
packaging technologies ... IMAPS Advertising · IMAPS Publications - Journal,
Advancing Micro, CD-Roms. ... Invited paper 1: The State of Electronic Industry in
Poland, ....
瀏覽:1174
日期:2025-05-17
Journal of Microelectronics and Electronic Packaging ... R. Muller-Fiedler, B.
Alabsi and P. Rothacher, Microsystem Technologies; C. Muller, H. Reinecke and
R....
瀏覽:1306
日期:2025-05-14
Journal of Microelectronics ... download pdf of full Journal - 100mb ... for
Multilayer Ceramic Components and High Defi nition Printed Electronic Devices
... M. Lejeune, SPCTS; P. Laurier and D. Detemmerman, CMAC; P. Escure and H.
Laville, ...
瀏覽:503
日期:2025-05-16
IMAPS will lead the Microelectronics Packaging, Interconnect and Assembly ...
David Clark, Raytheon Systems Limited; R. F. Thompson, A. E. Murphy, E. P
Ramsay, .... for publishing in the Journal of Microelectronics and Electronic
Packaging....
瀏覽:1400
日期:2025-05-17
IMAPS is bringing together the entire microelectronics supply chain. The largest
society dedicated to the advancement and growth of microelectronics and
electronics packaging technologies through ... Journal of Microelectronics ...
Umesh P. Gomes...