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www.spil.com.twSiliconware's Quad Flat No Lead, QFN package is a plastic encapsulated leadframe based CSP with a lead pad on the bottom of the package to provide electrical interconnection with the printed circuit board. This package offers a small form factor with 60 .瀏覽：571 -
![How to solder QFN SMT package chip by hand (video) | XueMing]()
zavax.wordpress.comQFN pitch could be as small as 0.5mm. To make the things worse, there are no leads coming out of the package. The only externally accessible contacts are on the sides, which seem to be the last hope to solder by hand. But impossible is nothing! I'll show瀏覽：621
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日期：2025-05-05
2010年4月28日 - QFN (Quad Flat No leads，四方平面無引腳封裝)目前有越來越普遍的趨勢，它的優點是體積小，足以媲美CSP (Chip Scale Package)，而且成本也 ......
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日期：2025-05-05
DFN and QFN Packages. AN1902 Application Note Rev. 7.0 10/2014. Freescale Semiconductor, Inc. 3. 3.2 Package Dimensioning. Available packages range ......
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日期：2025-05-03
Freescale QFN packages during Printed Circuit Board. (PCB) assembly, and guidelines for PCB design and rework, and package performance information (such ......
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日期：2025-05-06
The MLP is a near CSP plastic encapsulated package using conventional copper lead .... conjuction with evolving QFN guidelines in IPC-SM-782 in designing ......
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日期：2025-05-04
Amkor's MicroLeadFrame (MLF / QFN / MLP / VQFN / LFCSP) package is a near CSP plastic encapsulated package with a copper leadframe substrate....
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日期：2025-05-04
Amkor Technology offers its Quad-Flat No-Lead (QFN) package design kit for Agilent Technologies' Advanced Design System (ADS) electronic design ......
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日期：2025-05-03
mentioned packages. Additionally, the absence of external leads eliminates bent-lead concerns and issues. These QFN packages have reliable solderability ......
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日期：2025-05-07
of external leads eliminates bent-lead concerns and issues. This QFN package is packed to industry-standard tape-and-reel specifications. Package marking is ......
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