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日期:2025-06-25
Available in a 2 × 2 × 0,8 mm SON Package. The Power Save Mode is optimized for low output voltage ripple. For low noise applications, the device....
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日期:2025-06-25
(1) For the most current package and ordering information, see the Package Option Addendum at ... (3) The DSG (SON-8) packages is available in tape on reel....
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日期:2025-06-20
Additional Information. DS4 2012-05. Recommendations for Printed. Circuit Board Assembly of Infineon. SON Packages ......
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日期:2025-06-23
PACKAGE INFORMATION. PE-SON-8-101020. • SON-8. Unit: mm. PACKAGE DIMENSIONS. 3.0. ±. 0.2. 2.8. ±. 0.2. 0.3±0.1. 2.9±0.2. 0.13. ±. 0.05. ∗. ∗. ∗....
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日期:2025-06-24
PACKAGE INFORMATION. PE-SON-6-101018. • SON-6. Unit: mm. PACKAGE DIMENSIONS. 3.0. ±. 0.15. 2.6. ±. 0.2. 0.13. ±. 0.05. 1.6±0.2. 0.2±0.1. 0.85Max....
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日期:2025-06-21
Flat no-leads, also known as micro leadframe (MLF) and SON (small-outline no leads) ... Flat no-lead is a near chip scale package plastic encapsulated package ......
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日期:2025-06-20
This is the page which is introducing Integrated Circuit Packages of FUJITSU. ... SON (Small Outline Non-Leaded Package) QFN (Quad Flat Non-Leaded ......
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日期:2025-06-25
Amkor's ChipArray CASON packages are offered in laminate format and are available as Ball Grid Array. The near-chip-size standard outlines offer fixed body ......