3d ic封裝技術的相關文章
3d ic封裝技術的相關公司資訊
3d ic封裝技術的相關商品

南茂科技 >> 產品與服務 >> IC封裝服務 >> 量產產品系列
瀏覽:948
日期:2025-06-06
ChipMOS' Chip On Glass (COG) package provides the low cost driver IC packaging technology for the application in flat panel displays. Furthermore, the driving module can be manufactured by using TCP and COF technology with finer inner lead pitch, and more...看更多