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日期:2025-05-04
2008年8月14日 - COB (Chip On Board)在電子製造業並不是一項新鮮的技術,但最近我卻常常被問到相關的問題及資料索取。也許真的是產品越來越小了,而較進階 ......
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日期:2025-04-30
COB(Chip on Board)是積體電路封裝的一種方式。COB作法是將裸晶片直接黏在電路板或基板上,並結合三項基本製程:(1)晶片黏著(2)導線連接(3)應用封膠技術, ......
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日期:2025-05-02
Chip-on-Board (COB). Chip-on-Board, or COB, refers to the semiconductor assembly technology wherein the microchip or die is directly mounted on and ......
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日期:2025-04-30
A bare chip that is mounted directly onto the printed circuit board (PCB). After the wires are attached, a glob of epoxy or plastic is used to cover the chip and its ......
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日期:2025-04-29
Chip-on-Board, or COB, applications consist of die directly attached to its circuit board. COB assemblies improve package performance as a result of the shorter ......
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日期:2025-04-29
Chip-on-board, COB, is a technology where uncoated semiconductor elements ( dice, die, chip) are mounted directly on a PCB or a substrate of e.g. glasfibre ......
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日期:2025-04-29
Chip-on-board or chip-on-substrate assembly technology relies on widely available die attach and wire bond infrastructure to ensure highly reliable ......
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日期:2025-05-03
The video shows the process of removing the epoxy resin using a scalpel and a heat gun (fired up ......