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  WaferPlus 光玥公司簡介 WaferPlus 為專業光學材料供應商, 提供半導體 (Semiconductor), 微機電 (MEMS), 高亮度 LED (UHB LED), 光電 (Optoelectronics), 太陽能 (PV Solar), 顯示器 (Display) 產業所需的特製光學材料. 產品來自光學技術之鄉的德國, 工廠通過 ISO9001, ISO 14001, ...
  
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  The 2014 European 3D TSV Summit: The Domino Effect | 3D Incites
  
  The 2014 European 3D TSV Summit comprised 332 attendees from 21 countries, 24 presentations, 3 keynote speakers, and 2 panel discussions about 3D TSVS. ... I just boarded my flight home after attending the 2014 European 3D TSV Summit. Three days, 332 ...
  
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Real 3D IC Solutions

日期：2026-04-22

Real 3D IC Solutions Charles G. Woychik, Ph.D. Director of 3D Technology & Marketing Invensas Corporation 2702 Orchard Parkway San Jose, CA 95134 ... • Architect and builder: Shreve, Lamb and Harmon - Estimated Cost: $43M - Final Cost: $24.7M...

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Triton Micro Technologies: Through-glass-via (TGV) interposer - 3D InCites

日期：2026-04-20

Product Description Triton Micro Technologies’ ultra-thin through-glass-via (TGV) interposers create 3,000 or more I/O connections per device for high-density IC packaging. Triton uses micro-drilling and via-fill technologies to manufacture 2.5D and 3D TG...

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GIT 2013 Home - PRC Homepage

日期：2026-04-20

THE EVENT The Global Interposer Technology 2013 Workshop (GIT 2013), sponsored by IEEE, is intended to stimulate development of most advanced semiconductor and systems packaging technologies, comparing and contrasting a wide variety of interposer ......

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Triton Micro Technologies: Through-glass-via (TGV) interposer

日期：2026-04-23

ARIZ.-Triton Micro Technologies’ ultra-thin through-glass-via (TGV) interposers create 3,000 or more I/O connections per device for high-density IC packaging. Triton uses micro-drilling and via-fill technologies to manufacture 2.5D and 3D TGV interposers ...

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Myth, niche or high volume necessity? 3D Silicon & Glass Interposers, 2010 Report | PRLog

日期：2026-04-21

Myth, niche or high volume necessity? 3D Silicon & Glass Interposers, 2010 Report. 3D Silicon and Glass Interposers: Technologies, Applications & Markets - Next Generation Package Substrates. - PR10862185 ... PRLog - Aug. 16, 2010 - LYON, France-- Yole .....

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Solder Assembly Solutions for 3D IC Packaging

日期：2026-04-17

Material Selection and Development Key areas: • Interposer Material choice – Si vs glass – Glass has the potential to be lower cost (panel vs wafer) – Supply chain is relatively immature (TGV formation and fill) – Potential performance advantages being de...

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UltraHigh I/O Density Glass/Silicon Interposers for High Bandwidth Smart Mobile Applications

日期：2026-04-19

TABLE II. Typical interconnect dimensions in 3D IC vs ultra-thin glass interposer 3D IC Ultra-thin Parameter with TSVs glass interposer Diameter 4-50µm 5-20µm TSV/TPV pitch 10-80µm 10-40µm Thickness 20-250µm 30-50µm RDL wiring Lines/Space .5-2µm 5-10µm...

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Millimeter-Wave Transceiver Module Integration in 3D Silicon Interposer Technology

日期：2026-04-23

State-of-the-Art – Previous work | 6 60-GHz Transceiver module on ceramic (CEA-LETI/STM) HTCC module (Kyocera), size 12.5x8.5x0.5 mm3, CMOS transceiver and CMOS PA (CMOS 65 nm, STM) Folded dipole antenna on glass (IPD techno., STM), LGA ......

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