Advanced Thermal Interface Materials for Enhanced Flip Chip BGA

Advanced Thermal Interface Materials for Enhanced Flip Chip BGA

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日期:2025-05-27
Advanced Thermal Interface Materials for Enhanced Flip Chip BGA Punit Kohli, Martin Sobczak, Jeff Bowin, Michael Matthews Ablestik Laboratories Rancho Dominguez, California Abstract Increased functionality and performance requirements for microprocessors ...看更多