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BGA, CSP and flip chip | Solid State Technology
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日期：2025-05-21
CSPs are typically 7 to 12 mm square and have a large gap to be underfilled. Most of the time these only require a single pass underfill and the fluids are either lightly or not filled. No-flow Underfill No-flow underfill has been promoted to speed the un...看更多
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