flip chip package的相關文章
flip chip package的相關商品
Faraday Technology Corporation - Flip-Chip Package
瀏覽：1022
日期：2025-12-18
Flip-Chip Package Flip chip technology has its name by flipping over the chip to connect with the substrate. Unlike conventional interconnection through wire bonding, flip chip uses solder or gold bumps instead. Therefore, the I/O pads can be distributed ...看更多
網友正在看
熱門 美妝保養 文章
熱門 xbox 文章
![[面白日本] 東大五月祭特輯：弓道部「鳴弦之儀」-- 日本人傳承文化的方式就是不斷重做！](https://www.iarticlesnet.com/pub/img/article/69178/1432117276128_xs.jpg)