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FINEPLACER® femto - Automated Sub-micron Die Bonder
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日期：2025-12-21
Automated, sub-micron die bonder for flip chip bonding and optoelectronic applications, versatile platform for various assembly technologies including thermosonic bonding, ultrasonic bonding, adhesives, soldering, UV curing. ... The FINEPLACER ® femto is ...看更多
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