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Implementing Xilinx Flip-Chip BGA Packages
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日期：2025-10-07
4 www.xilinx.com XAPP426 (v1.3) March 3, 2006 R Implementing Xilinx Flip-Chip BGA Packages Reflow Profiling An optimized profile is paramount in achieving successful reflow result. A good starting point is to refer to the solder paste manufacturer’s sugge...看更多
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