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AFC Plus- Die Bonder and Flip Chip Bonder - AMICRA microtechnologies
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日期：2025-10-16
The AFC Die Bonder / Flip Chip Bonder is designed for the following markets: Micro optics LED and MEMS assembly Semiconductor advanced packaging (3D, Stack Die etc.) Dedicated for volume production For questions regarding the AFC Die Bonder / Flip Chip .....看更多
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