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日期:2024-04-24
Amkor Flip Chip BGA (fcBGA) packages are assembled around state-of-the-art,
single unit laminate or ceramic substrates....
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日期:2024-04-22
IMPORTANT NOTICE. Texas Instruments Incorporated and its subsidiaries (TI)
reserve the right to make corrections, modifications, enhancements ......
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日期:2024-04-19
Amkor Flip Chip BGA (fcBGA) packages are assembled around state-of-the-art, single unit laminate or ceramic substrates. ... Flip chip interconnect utilizes array interconnect of die to substrate as a replacement for conventional wire bonding. This allows ...
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日期:2024-04-25
CSPs are typically 7 to 12 mm square and have a large gap to be underfilled. Most of the time these only require a single pass underfill and the fluids are either lightly or not filled. No-flow Underfill No-flow underfill has been promoted to speed the un...
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日期:2024-04-26
4 www.xilinx.com XAPP426 (v1.3) March 3, 2006 R Implementing Xilinx Flip-Chip BGA Packages Reflow Profiling An optimized profile is paramount in achieving successful reflow result. A good starting point is to refer to the solder paste manufacturer’s sugge...
Amkor Technology: fcCSP | Flip Chip CSP | PSfcCSP | fc CSP | | FCLGA | Flip Chip LGA | Flip Chip BGA
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日期:2024-04-26
Amkor Technology is now offering the Flip Chip CSP (fcCSP) package -- a flip chip solution in a CSP package format. ... Amkor Technology offers the Flip Chip CSP (fcCSP) package -- a flip chip solution in a CSP package format. This package construction ut...
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日期:2024-04-26
wwwhipp FEATURES • Body sizes range from 12mm x 12mm to 55mm x 55mm • Pb-free, Cu column, Eutectic or High Pb bumps (Cu column micro bumps in development) • Cu column with Mass Reflow (MR) • Bump pitch qualified: 130µm for Pb-free; 80µm for Cu column • 0....
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日期:2024-04-23
Advanced Thermal Interface Materials for Enhanced Flip Chip BGA Punit Kohli, Martin Sobczak, Jeff Bowin, Michael Matthews Ablestik Laboratories Rancho Dominguez, California Abstract Increased functionality and performance requirements for microprocessors ...