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![台灣芝浦先進科技股份有限公司]()
www.shibaura.com.tw•液晶面板生產設備 FPD Manufacturing Equipment (日語) (英語) Array Process : Wet Cleaning ／ Stripping ／ Developing ／ Etching Equipment Cell Process : Inkjet Coater ／ Cell Assembly Equipment Module Process : Outer Lead Bonding System瀏覽：366 -
![Flip Chip Bonder - ASM Pacific Technology Ltd]()
www.asmpacific.comFlip Chip Bonder. High speed, precise and flexible solution to Flip Chip applications. Flux Dispensing /. Dual Head Flux ...瀏覽：665
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日期：2026-04-20
Flip-Chip Bonder. ... 全自動量產型Flip Chip bonder，應用於高階覆晶封裝技術.
more. 產品應用. 產品規格. 聯絡方式 ......
瀏覽：1163
日期：2026-04-19
The AFC Plus is a die bonder and flip chip bonder system with high precision and
placement accuracy (+/ 0.5 µm), ......
瀏覽：773
日期：2026-04-21
AMICRA Microtechnologies' high precision die bonder and flip chip bonders,
wafer ink systems and dispense & test ......
瀏覽：406
日期：2026-04-24
... Flip Chip / Die Bonder. FC150 Flip Chip Bonder - Reflow Arm. FC150 Flip Chip
Bonder - Gas Confining Enclosure ......
瀏覽：369
日期：2026-04-23
Flip Chip Bonder (for SiP/COC/CSP) FC3000S. Features. A semi-automatic
machine, suited for conducting R&D work ......
瀏覽：336
日期：2026-04-23
Flip chip bonder which can be switched to either the thermo-compression
process or ultrasonic bonding process with a ......
瀏覽：1318
日期：2026-04-22
Automated, sub-micron die bonder for flip chip bonding and optoelectronic
applications, versatile platform for various ......
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