Flip Chip - Automated Wire Bonding, Die Attach, and Contract Assembly Serv

Flip Chip - Automated Wire Bonding, Die Attach, and Contract Assembly Serv

瀏覽:986
日期:2025-12-21
High accuracy wire bonding and die attach systems and processes from Palomar Technologies. ... Flip Chip Flip chip is a method used for components or devices that can be bonded directly onto a substrate, board or carrier face-down....看更多